Arrhythmias & electrophysiology
Temporal Association Between Atrial Fibrillation Burden in Cardiac Implantable Electronic Devices and the Risk of Heart Failure Hospitalization
Main finding · Temporally associated HF eventResult — go to the resultOdds ratio 3.93 95% CI 3.36–4.60Authors' conclusion
In a large real-world population of patients with CIED devices, AF burden was associated with HF hospitalization risk in the subsequent 30 days. The risk is increased with AF and an uncontrolled ventricular rate.
Study context
- Population
- Patients with cardiac implantable electronic devices (CIEDs) and HF events, Optum de-identified EHR, 2007–2021
- Participants
- 7,257 HF events
- Exposure
- Atrial fibrillation (AF) events in case period vs control period
- Outcome
- HF event temporally associated with AF event (AF burden ≥5.5 h/d)
- Follow-up
- 30 days before HF event
Methodological detailsretrospective, EHR linked to device manufacturer data warehouse
- Retrospective
- EHR linked to device manufacturer data warehouse
Main finding
Temporally associated HF event
Odds ratio
3.93
95% CI 3.36–4.60
Events by group
Case periodvs Control period
OR 3.93 (95% CI 3.36–4.60)
As reported in the abstract
Observational data: associations, not effects.
Further findings
| Outcome | OR (95% CI) | |
|---|---|---|
| HF event with stay >3 days | 4.51 (3.57–5.68) | |
| 0.20.5125Odds ratio (log scale) |
HF event risk with poorly rate-controlled AF (>110 bpm) in case period, in patients with AF in both periods
| OR (95% CI) | ||
|---|---|---|
| Poor AF rate control | 1.78 (1.22–2.61) | |
| 0.20.5125Odds ratio (log scale) |
AF event in 10 days after HF event, in patients without prior AF events
- Patients with AF event after HF event
- 222 of 4759 (5%)
Original publication
Temporal Association Between Atrial Fibrillation Burden in Cardiac Implantable Electronic Devices and the Risk of Heart Failure Hospitalization. Circ Arrhythm Electrophysiol. Published 28 June 2024. doi:10.
Composed by AI from the published abstract and checked against it. How Briefs are made →